Just less than 70% of all production related issues are traced back to the printing process. PCB 101 will address critical issues to consider for defect free and reliable solder paste printing.
Who should attend?
Quality engineers, manufacturing engineers, design engineers, engineering managers, process engineers, buyers and engineering students.
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This informative session will focus on:
Screen Printing Considerations
Lisa Collins-Sheffield, Speedline
50-70% of the end of the line defects stem from poor printing processes. Some factors that control the performance of the solder paste printing process include quality of the printing machine itself, solder paste, stencil, room environment, support tolling and under stencil cleaning must be optimized and monitored to achieve consistent, high quality printing results. This presentation will cover the important aspects of the solder paste printing process and how to improve the overall process.
Tony Lentz, FCT Assembly
Nano coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include: reduced underside cleaning, reduced bridging, improved solder paste release, etc. How can the performance be quantified?
Dr. Bill Coleman, PhotoStencil
Stencil designs come in various configurations and styles depending upon the type and pitch of the components being assembled. Aperture design is only a part of the stencil design. When there is a mix of SMD devices, small pitch/large pitch, and large discrete devices, etc., it is difficult to satisfy paste volume requirements wit a singe thickness stencil.
Patty Chonis, kolb Cleaning Technologies
A large percentage of printing errors can be traced back to partially clogged apertures left by inadequate cleaning. With increased market pressure to produce higher quality products at lower prices, high production yields are required. Today, the stencil cleaning process is considered a value added procedure, and is more than just the absence of solder paste in the stencil apertures. In addition, the use of safe chemistries, zero discharge and water free processes to reduce the environmental impact are also primary concerns.
701 Delaware Ave.
Longmont, CO 80501
May 13th, 2015
Member $35 / Nonmember $40
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